Ion-induced secondary electron emission at a target surface is an essential mechanism for laboratory plasmas, i.e. magnetron sputtering discharges. Electron emission, however, is strongly affected by the target condition itself such as oxidation. Data of oxidized targets, however, are very sparse and prone to significant systematic errors, because they were often determined by modeling the complex behavior of the plasma. Thus, it is difficult to isolate the process of ion-induced electron emission from all other plasma-surface-interactions. By utilizing ion beams, the complex plasma environment is avoided and electron yields are determined with higher accuracy. In this study, ion-induced secondary electron emission coefficients (SEECs) of clean, untreated (air-exposed), and intentionally oxidized copper and nickel surfaces were investigated in such a particle beam experiment. Pristine and oxidized metal foils were exposed to beams of singly charged argon ions with energies of 0.2 keV - 10 keV. After the ion beam treatment, the surface conditions were analyzed by ex-situ x-ray photoelectron spectroscopy measurements. Further, a model for the electron emission of a partly oxidized surface is presented, which is in agreement with the experimental data. It was found, that oxidized and untreated/air-exposed surfaces do not show the same SEEC: for intentionally oxidized targets, the electron yields were smaller by a factor of 2 than for untreated/air-exposed surfaces. SEECs of oxides were found to be between the values for clean and for untreated metal surfaces. Further, the SEEC was at maximum for untreated/air-exposed surfaces and at minimum for clean surfaces; the electron yields of untreated/air-exposed and clean surfaces were in agreement with values reported in the literature.
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Authors | |
Release Date | 2022-02-22 |
Identifier | f6fa3f93-4c89-415a-a6b3-ebece96a12a5 |
Permanent Identifier (DOI) | |
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Is supplementing | |
Plasma Source Name | |
Plasma Source Application | |
Plasma Source Properties | (1) ECR: Type Gen2 by Tectra GmbH: microwave. applied ion Energy: 2keV. ion flux=2E14 cm^-2 s^-1
(2) Colutron (ICP) by Beam Imaging Solutions USA. ion energy: 200eV - 10keV. Ar flow into ICP adjusted to a constant pressure.... Wien Filter:
(3) OBS oxygen beam source (capillary source) by MBE Komponenten GmbH. O2 flow= 0.3sccm O2. Temperature TBC |
Language | English (United States) |
License | |
Plasma Medium Name | |
Plasma Target Name | |
Contact Name | Buschhaus, Rahel |
Plasma Target Properties | copper: metal foil by Alfa Aesar, Thermo Fisher GmbH. Thickness: 254 µm, purity of 99.9%
nickel: metal foil by Evochem Advanced Materials GmbH. Thickness: 100µm, purity of 99.9% |
Contact Email | |
Plasma Diagnostic Properties | (surface diagnostics, not plasma diagnostics):
(1) ex-situ XPS: PHI5000 x-ray photoelectron spectrometer using Al Kα radiation
at 1486.6 eV
(2) ex-situ XRD: TBC |
Public Access Level | Public |
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Data and Resources
- Data Figure 6 plus 7 for Copperxlsx
calculated gammas in dependence of Ar/O flux and oxygen coverage
Download - Data Figure 6 and 7 for nickelxlsx
calculated gammas in dependence of Ar/O flux and oxygen coverage
Download